MEMS Service

Process capabilities include:

Deposition Processes (Capabilities for multiple sized wafers)

• LPCVD/PECVD
• LSN
• SiO2 (LTO/HTO)
• Si3N4
• Poly Si
• Thermal Oxidation
• Thermal Annealing
• Metallization (e-beam and sputtered)
• Au, Pt, Ti, Cr, TiN, TaN, Ag, Ni, Pd, W, Al, Au/Sn
• Liftoff and Shadow masking

Etch Processes (Capabilities for multiple sized wafers)

• RIE/DRIE
• Si
• SiO2
• Si3N4
• Ti
• Others
• Wet-etching
• Wet etch chemistries for most materials and substrates
• Wet anisotropic Bulk Silicon micromachining for <100> and <110> orientations

Lithography

• Contact and Step printing
• Multiple layer capability
• Backside processing available
• Feature size CDs to 1um

Design / process development

• Bulk micromachining, Surface micromachining, and MEMS

Other

• Precision Lapping
• Wafer bonding
• high precision dicing