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MEMS Service

IWS now offers processing services and consulting for MEMS / MST and Micromachining

Process capabilities include:

Deposition Processes (Capabilities for multiple sized wafers)

  • LPCVD/PECVD
  • LSN
  • SiO2 (LTO/HTO)
  • Si3N4
  • Poly Si
  • Thermal Oxidation
  • Thermal Annealing
  • Metallization (e-beam and sputtered)
  • Au, Pt, Ti, Cr, TiN, TaN, Ag, Ni, Pd, W, Al, Au/Sn
  • Liftoff and Shadow masking

Etch Processes (Capabilities for multiple sized wafers)

  • RIE/DRIE
  • Si
  • SiO2
  • Si3N4
  • Ti
  • Others
  • Wet-etching
  • Wet etch chemistries for most materials and substrates
  • Wet anisotropic Bulk Silicon micromachining for <100> and <110> orientations

Lithography

  • Contact and Step printing
  • Multiple layer capability
  • Backside processing available
  • Feature size CDs to 1um

Design / process development

  • Bulk micromachining, Surface micromachining, and MEMS

Other

  • Precision Lapping
  • Wafer bonding
  • high precision dicing
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